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HOLGER CLASEN WS80-K Polishing sponge

WS80-K Polishing sponge

Technical specifications
Outer Ø: 80 mm
Thickness: 25 mm
Contact Area: Wafer Sponge
Hardness: super soft
Chuck: Velour (for Grinding plate with velcro)
Weight: 5 g
Included in delivery:

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