WS133-K
Polishing sponge

Polishing sponge
Outer Ø: 133 mm

  • 17173002
WS133-K
Polishing sponge

Technical specifications

Outer Ø: 133 mm
Thickness: 22 mm
Contact Area: Wafer Sponge
Hardness: middle hard
Chuck: Velour (for Grinding plate with velcro)
Weight: 15.5 g

The following Documents are available:

Viewed