WS80-K
Polishing sponge

Polishing sponge
Outer Ø: 80 mm

  • 12199040
WS80-K
Polishing sponge

Technical specifications

Outer Ø: 80 mm
Thickness: 25 mm
Contact Area: Wafer Sponge
Hardness: super soft
Chuck: Velour (for Grinding plate with velcro)
Weight: 5 g

The following Documents are available:

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